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Sheartest to evaluate wirebonds/bonding
CSEM SA
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
MedPhab partner
[TECHNICAL] DEVELOPMENT SUPPORT
Development Support
DEVELOPMENT SUPPORT [Characterization testing /services] Optical, electronics, mechanics
"[Characterization testing /services] Optical, electronics, mechanics"
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Consultancy
The multi-purpose sheartester is used to better characterize bonding shearforce and failure mode. This is suited for die-attach interconnections, wirebonding wires, and solder balls / Stud-bumps.
Sheartester Type DAGE 4000
Tools available Ball-Shear
Maximum wafer size 8
Custom holder for chips on chips suited for 300um high chip-on-chip. Other thickness available upon request
Force maximum range across different tools 1g-100Kg
Motorized stage XY and Z yes
Software for data-log and statistical analysis yes
Calibration kits for different force ranges available
The multi-purpose sheartester is used to better characterize bonding shearforce and failure mode. This is suited for die-attach interconnections, wirebonding wires, and solder balls / Stud-bumps.
CSEM DS3 0010 V1.0
ISO 9001 / MIl-Std 883
N/A