IMEC's SiN BIOPIX platform
imec
MedPhab partner
[TECHNICAL] TECHNICAL SERVICES
Photonic components
PHOTONIC COMPONENTS [Integrated circuits] Silicon photonics
PC1 Integrated circuits
Silicon photonics
in vitro diagnostics
Technology provider Manufacturer Production services Integrator R&D
Silicon Nitride Photonics

BioPIX is imec’s silicon nitride (SiN) photonics platform which is particularly optimized for applications in the visible and near infra-red wavelengths. The platform is based on PECVD SiN-on-insulator 200mm wafers processed on 180nm process technology in a CMOS fab. This allows highly repeatable and low variability fabrication of integrated photonic devices. The technology has been validated through 6 early-access MPWs in the EU project PIX4life.

BioPIX is available in two different technology flavors:

  • BioPIX150, based on 150nm thick SiN, for applications in the wavelength range of 400nm – 700nm.
  • BioPIX300, based on 300nm thick SiN, for applications in the wavelength range of 700nm – 1000nm.

The platform offers possibility of two depth levels for SiN etch to allow fabrication of components such as strip waveguide, rib waveguide, shallow and fully etched grating couplers etc. The platform allows selective removal of cladding from waveguides for micro-fluidic channels and sensing zones etc. The platform also offers two layers of metals for functions such as thermo-optic tuning, electrical inter-connects etc., and a layer for deep trench etch for devices such as edge couplers.

Designing for this platform is supported through the process-design-kits (PDK) for Synopsys and Luceda Photonics software. The PDK includes technology files for designing, design library of building block components (waveguides, grating couplers, MMIs, directional couplers etc.), and documentation describing the technology, design rules and library components.

BioPIX is imec’s silicon nitride (SiN) photonics platform which is particularly optimized for applications in the visible and near infra-red wavelengths. The platform is based on PECVD SiN-on-insulator 200mm wafers processed on 180nm process technology in a CMOS fab.
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MPW: 20 dies + 20 upon availability / bilateral: t.b.d